Product No: SMT-TD15
Purpose:
Telecom-Test Probe meets IEC60950 Figure 2C and
standards. is for the absolute share TNV circuits information technology to see if they provide sufficient protection.
Contacts of terminals for TNV CIRCUITS which cannot be touched by the test probe figure B.1, are an additional exemption from the requirement for inaccessible TERMINAL contacts.
Apparatus containing input TELECOMMUNICATION NETWORK leads over which ringing voltages are applied to the equipment shall be subjected to Leakage Current due to Ringing Voltage tests per 6.3.4.3 of UL 1950, Third Edition.
Conforms to:
Standard UL6500 Figure B.1 / IEC60950-1 Figure 2C etc.
Technical Parameter:
Test probe diameter: 12mm
Test probe length: 80mm
Baffle plate thickness: 5mm
Baffle plate diameter: 50mm
UL6500 Figure B.1 12mm Hemispherical Hard Rod
TIEC/EN 60950 12mm Hemispherical Hard Rod
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